Huawei H13-231

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Huawei H13-231 Exam Syllabus Topics:

Huawei HCIE-Intelligent Computing V1.0 Sample Questions:

1. Which role does Huawei or the company participate in the chip industry chain?

A) Chip packaging and testing
B) Chip design
C) Terminal application
D) Chip manufacturing

2. Which of the following statement about the chip is wrong?

A) Currently the semiconductor components commonly used in chips are diode.
B) The current chip manufacturing process is nanoscale.
C) Chips are usually made of semiconductors.
D) The essence of a chip is an integrated circuit.

3. MIPS is based on RICS technology, coupled with the scalable hardware and software design in the MIPS architecture, making MIPS solutions ARM's similar solutions have higher performance and lower power consumption.

A) False
B) True

4. In the process of TaiShan service system tuning, it is first necessary to understand the system performance metrics. In the process of network tuning. Which of the following performance indicators are more important?

A) Use swap space
B) IO average waiting time
C) CPU usage
D) Packet loss rate

5. The basic principle of FPGA is to integrate a large number of digital circuit basic gate circuits and memory in the chip. It appeared as a semi-custom circuit in the field of application-specific integrated circuits (ASIC). What are the advantages of FPGA compared to ASIC? (Multiple choice)

A) One-time cost
B) Performance
C) Speed to market
D) Mass production cost

Solutions: